By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential street for non-stop functionality progress in built-in circuits (IC) because the traditional scaling strategy is confronted with unparalleled demanding situations in basic and financial limits. Wafer point 3D IC can take a number of kinds, they usually frequently contain a stack of numerous thinned IC layers which are vertically bonded and interconnected through via silicon through TSV.
There is a protracted string of advantages that you'll derive from 3D IC implementation equivalent to shape issue, density multiplication, more advantageous hold up and tool, greater bandwidth, and heterogeneous integration. This booklet offers contributions via key researchers during this box, protecting motivations, expertise systems, functions, and different layout matters.
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